公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2010 | Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology | T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin | IEICE Transactions on Communications | 13 | ||
2013 | Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression | C.-D. Wang; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 13 | ||
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. |