公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
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2016 | Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer | Chen, C.-C.A.; Young, H.-T.; Chiou, C.-H.; Xue, M.-Y.; Pan, C.-L.; HONG-TSU YOUNG | China Semiconductor Technology International Conference 2016 |