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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer
Details
Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer
Journal
China Semiconductor Technology International Conference 2016
Date Issued
2016
Author(s)
Chen, C.-C.A.
Young, H.-T.
Chiou, C.-H.
Xue, M.-Y.
Pan, C.-L.
HONG-TSU YOUNG
DOI
10.1109/CSTIC.2016.7464034
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/447486
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84974604196&doi=10.1109%2fCSTIC.2016.7464034&partnerID=40&md5=9e0c7773f59e5d32614ee971c4f8de14
Type
conference paper