Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer

Journal

China Semiconductor Technology International Conference 2016

Date Issued

2016

Author(s)

Chen, C.-C.A.

Young, H.-T.

Chiou, C.-H.

Xue, M.-Y.

Pan, C.-L.

DOI

10.1109/CSTIC.2016.7464034

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/447486

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84974604196&doi=10.1109%2fCSTIC.2016.7464034&partnerID=40&md5=9e0c7773f59e5d32614ee971c4f8de14

Type

conference paper