https://scholars.lib.ntu.edu.tw/handle/123456789/447486| Title: | Study on CMP process of glass wafers with SiO2 based slurry for trench-glass-via interposer | Authors: | Chen, C.-C.A. Young, H.-T. Chiou, C.-H. Xue, M.-Y. Pan, C.-L. HONG-TSU YOUNG |
Issue Date: | 2016 | Source: | China Semiconductor Technology International Conference 2016 | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/447486 | DOI: | 10.1109/CSTIC.2016.7464034 |
| Appears in Collections: | 機械工程學系 |
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