公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1991 | Grain boundary pest of boron- doped Niin3Al at 1200 ?C | Chuang, T. H.; Pan, Y. C.; Hsu, S. E.; ChuangTH | Metallurgical and Materials Transactions A | | | |
1994 | High Temperature Oxidation Behavior of Ni3Al Intermetallic Compounds Containing Zr and Hf | Chang, T. T.; Chuang, T. H. | Chin. J. Mat. Sci. 26: | | | |
1998 | Improving the Creep Resistance of NiAl-Intermetallics through Phase Strengthening-Review and Perspective | Chuang, T. H. | Chin. J. Mat. Sci | | | |
1991 | The Influences of Chromium Addition on the Corrosion Behaviors of Ni3Al-Intermetallic Compounds in Aqreous Solutions | Pan, Y. C.; Chuang, T. H. | Chin. J. Mat. Sci. 23: | | | |
1997 | Interfacial Characteristics for Active Brazing of Alumina to Superalloys | Weng, W. P.; Wu, H. W.; Chai, Y. H.; Chuang, T. H. | Journal of advanced materials | | | |
1997 | Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals | Weng, W. P.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
2002 | Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate | Chiang, M. J.; Chuang, T. H. | Zeitschrift fur Metallkunde | | | |
2000 | Interfacial Reactions between In10Ag Solders and Ag Substrates | Liu, Y. M.; Chuang, T. H. | Journal of Electronic Materials | | | |
2000 | Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates | Huang, Y. T.; Chuang, T. H. | Zeitschrift fur Metallkunde 91: | | | |
2000 | Interfacial reactions between liquid indium and Au-deposited substrates | Liu, Y. M.; Chuang, T. H. | Journal of Electronic Materials | | | |
1999 | Interfacial reactions between liquid indium and nickel substrate | Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2000 | Interfacial Reactions between Liquid Indium and Silver Substrates | Liu, Y. M.; Chen, Y. L.; Chuang, T. H. | Journal of Electronic Materials | | | |
2002 | Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2002 | Intermetallic compounds formed at the interface between liquid indium and copper substrates | Yu, C. L.; Wang, S. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2002 | Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates | Chiu, M. Y.; Wang, S. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 0 | |
2003 | Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages | Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH | Journal of Electronic Materials | | | |
2002 | Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates | Chan, Y. C.; Chiu, M. Y.; Chuang, T. H. | Zeitschrift fur Metallkunde 93: | | | |
2006 | Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads | Chuang, T. H.; Yen, S. F.; Cheng, M. D. | J. Electron. Mater | | | |