公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2000 | Temperature Effects on the Erosion of Aluminum Alloy | Fang, C. K.; Chuang, T. H. | CIM Bulletin 93: | | | |
1997 | Thermal Analyses of Interfacial Reactions between Low Melting Point Active Fillers and Ceramics | Chai, Y. H.; Tsai, T. C.; Chuang, T. H. | Chin. J. Mat. Sci | | | |
2003 | Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers | Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H. | Journal of Electronic Materials | | | |
2001 | The Ultra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material | Tsao, L. C.; Wang, S. S.; Yang, C. F.; Chuang, T. H. | Zeitschrift fur Metallkunde 92: | | | |
1996 | Ultrasoni Measurements of Welding Residual Stress for SAE 4130 Steel Plates | Wu, T. T.; Shih, K. L.; Chuang, T. H. | Inspection Technology | | | |
1993 | Ultrasonic Measurement of Porosity in Ceramic Materials:a Preliminary Study | Chai, J. F.; Wu, Tsang-Tsong; Chuang, T. H. | The ROC Journal of Non-Destructive Testing | | | |
1991 | Ultrasonic Testing of Intrinsic Defects in Ceramics | 韋文誠 ; Chang, L. S.; Chuang, T. H.; 吳政忠 ; Wei, Wen-Cheng ; Wu, Tsang-Tsong | The 1991 Annual Conference of the Chinese Society for Materials | | | |