Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2012 | Roles of phosphorous in Sn 4Ag 0.5Cu solder reaction with electrolytic Ni-Au | Key Chung C.; Huang T.C.; Shia R.; Yang T.L.; C. ROBERT KAO | Journal of Alloys and Compounds | 7 | 9 | |
2014 | Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow | Key Chung C.; Zhu Z.X.; C. ROBERT KAO | Journal of Electronic Materials |