公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1995 | Shape Memory Intermetallics Development in Taiwan | Wu, S. K.; Lin, H. C.; WuSK | Acta Metallurgica Sinica (English Letters) | | | |
2006 | The Significant Role of Solid Oxide Interphase in Enhancement of Cycling Performance of Sn Thin-Film Anodes | Chiu, K.-F.; Lin, H. C.; Lin, K. M.; Lin, T. Y.; Shieh, D. T. | Journal of The Electrochemical Society | | | |
2001 | The slurry erosion characteristics of precipitation-hardened Ti49Ni51 shape-memory alloy | Wu, S. K.; Lin, H. C.; Yang, C. H.; HSIN-CHIH LIN | Shape Memory Materials and Its Applications | | | |
1989 | Spontaneous Focal Intestinal Perforation in Permaturity:Report of Three Cases | Lin, H. C.; Law, Han-Shin | Journal of Acta Paediatrica Sinica | | | |
2006 | Stability Improvement of LiMn2O4 Thin-Film Cathodes under High Rate and Over-Discharge Cycling | Chiu, K.-F.; Lin, H. C.; Lin, K. M.; Chen, C. C. | Journal of The Electrochemical Society | | | |
1992 | Strengthening Effect on Shape Recovery Characteristics of the Equiatomic TiNi Alloy | Lin, H. C.; Wu, Shyi-Kaan | | | | |
1985 | Structure of 5-(p-Methoxyphenyl)-3H-1,2-dithole-3-thione, C10H8OS3 | 王瑜; Lin, H. C.; Wei, C. H.; Wang, Yu | Acta Crystallographica | | | |
1994 | The Tensile Behavior of A Cold-Rolled and Reverse-Transformed Equiatomic TiNi Alloy | Lin, H. C.; Wu, S. K. | Acta Metallurgica et Materials | | | |
1994 | The Tensile Behavior of a Cold-Rolled and Reversed-Transformed Equiatomic TiNi Alloy | Lin, H. C.; Wu, Shyi-Kaan | Acta Metallurgica et Materials | | | |
2004 | Three-dimensional kinematic analysis of stepping over obstacles in young subjects | Chen, Hao-Ling; Lu, Tung-Wu; Lin, H. C. | Biomedical Engineering: Applications | | | |
1997 | Wear characteristics of TiNi shape memory alloys | Lin, H. C.; Liao, H. M.; He, J. L.; Chen, K. C.; Lin, K. M.; HSIN-CHIH LIN | Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science | | 75 | |
2000 | The Wire Drawing Conducted in The R-phase of TiNi Shape Memory Alloys | Wu, S. K.; Lin, H. C.; Yen, Y. C.; Chen, J. C.; WuSK | Materials Letters | | | |