公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2014 | 3-D transient analysis of TSV-induced substrate noise: Improved noise reduction in 3-D-ICs with incorporation of guarding structures | Lin, L.J.-H.; YIH-PENG CHIOU | IEEE Electron Device Letters | |||
2012 | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Lin, L.J.-H.; Chang, H.-P.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | |||
2015 | Optical design of GaN/In<inf>x</inf>Ga<inf>1-x</inf>N/cSi tandem solar cells with triangular diffraction grating | Lin, L.J.-H.; YIH-PENG CHIOU | Optics Express |