公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |