公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2019 | Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications | Wang Y.W.; Shih W.L.; Hung H.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 | |
2014 | Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints | Li C.C.; Chung C.K.; Shih W.L.; C. ROBERT KAO | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | 28 | 26 |