Serrated cathode dissolution under high current density: Morphology and root cause
Journal
Journal of Applied Physics
Journal Volume
114
Journal Issue
5
Date Issued
2013
Author(s)
Abstract
Excessive cathode dissolution due to high current densities is investigated. Such excessive dissolution is one of the key electromigration- induced degradation processes in micro systems, and exhibits a distinctive serrated morphology. In this study, Cu cathode and Cu anode connected with Sn is stressed at a 4.5 × 104 A/cm2 current density for time as long as 1500 h. Careful sequential micro polishing is able to establish for the first time that the serrated cathode interface in fact is the expression of rod-like indentations in three-dimensional morphology. This unique morphology supports the proposition that fast Cu diffusion through Cu 6Sn5 grain boundaries is the root cause for this excessive dissolution. © 2013 AIP Publishing LLC.
SDGs
Type
journal article