公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | |||
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 161 | ||
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. |