公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 161 | ||
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. |