公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2017 | Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns | Huang, K.-M.; Tsukamoto, H.; Yong, Y.; Chiu, H.-L.; Nguyen, M.T.; Yonezawa, T.; Liao, Y.-C.; YING-CHIH LIAO | RSC Advances | | | |
2011 | Transpeptidase-mediated incorporation of d-amino acids into bacterial peptidoglycan | Lupoli, T.J.; Tsukamoto, H.; Doud, E.H.; Wang, T.-S.A.; Walker, S.; Kahne, D.; TSUNG-SHING WANG | Journal of the American Chemical Society | 108 | 102 | |
2017 | Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature | Yong, Y.; Nguyen, M.T.; Yonezawa, T.; Asano, T.; Matsubara, M.; Tsukamoto, H.; Liao, Y.-C.; Zhang, T.; Isobe, S.; Nakagawa, Y.; YING-CHIH LIAO | Journal of Materials Chemistry C | | | |