| Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
|---|---|---|---|---|---|---|
| 2006 | Kinetics of AuSn 4 migration in lead-free solders | Chang C.W.; Ho C.E.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2007 | Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element | Yang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Applied Physics | |||
| 2006 | Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates | Tsai J.Y.; Chang C.W.; Ho C.E.; Lin Y.L.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | |||
| 2006 | Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu | Yang S.C.; Ho C.E.; Chang C.W.; Kao C.R.; C. ROBERT KAO | Journal of Materials Research | |||
| 2004 | Transcatheter occlusion of ruptured sinus of Valsalva aneurysm guided by three-dimensional transesophageal echocardiography. | Jean W.H.; Kang T.J.; Liu C.M.; Chang C.W.; Tsai S.K.; JOU-KOU WANG | Journal of the Formosan Medical Association = Taiwan yi zhi |
