Kinetics of AuSn 4 migration in lead-free solders

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

11

Pages

1948-1954

Date Issued

2006

Author(s)

Chang C.W.

Ho C.E.

Yang S.C.

DOI

10.1007/s11664-006-0298-3

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33845780610&doi=10.1007%2fs11664-006-0298-3&partnerID=40&md5=736ebaf8bdb1b7cee628c6bc8df447a4

https://scholars.lib.ntu.edu.tw/handle/123456789/432702

Type

journal article