公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Nanoscaled superelastic behavior of shape memory alloy/metallic glass multilayered films | Jhou W.T.; Wang C.; Ii S.; Hsueh C.H.; CHUN-HWAY HSUEH | Composites Part B: Engineering | |||
2015 | Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications | Yu J.J.; Yang C.A.; Lin Y.F.; Hsueh C.H.; CHUN-HWAY HSUEH ; C. ROBERT KAO | Journal of Alloys and Compounds | 32 | 32 | |
2008 | Origins of tensile stress-induced circumferential cracking of waterwall tubes in boilers | Hsueh C.H.; Wright I.G.; CHUN-HWAY HSUEH | Materials at High Temperatures | |||
1983 | Oxidation induced stresses and some effects on the behavior of oxide films | Hsueh C.H.; Evans A.G.; CHUN-HWAY HSUEH | Journal of Applied Physics | |||
1996 | R-curve response of silicon carbide whisker-reinforced alumina: microstructural influence | Sun E.Y.; Hsueh C.H.; Becher P.F.; CHUN-HWAY HSUEH | Materials Research Society Symposium | |||
2013 | Rapid relaxation and embrittlement of Zr-based bulk metallic glasses by electropulsing | Yiu P.; Chen Y.C.; Chu J.P.; Chang S.Y.; Bei H.; Jang J.S.C.; Hsueh C.H.; CHUN-HWAY HSUEH | Intermetallics | |||
2014 | Rapid thermoplastic formation of Fe-based metallic glass foil achieved by electropulsing | Yiu P.; Hsueh C.H.; Shek C.H.; CHUN-HWAY HSUEH | Materials Letters | |||
2007 | Recent advances in modeling stress distributions in multilayers subjected to biaxial flexure tests | Hsueh C.H.; Luttrell C.R.; CHUN-HWAY HSUEH | Composites Science and Technology | |||
1993 | The relative residual fibre displacement after indentation loading and unloading of fibre-reinforced ceramic composites | Hsueh C.H.; Ferber M.K.; Wereszczak A.A.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
1988 | Residual stress and strain in pyrolytic boron nitride resulting from thermal anisotropy | Naito N.; Hsueh C.H.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
1985 | Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging | HSUEH C.H.; EVANS A.G.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society | |||
1985 | Residual Stresses in Meta/Ceramic Bonded Strips | HSUEH C.H.; EVANS A.G.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society | |||
2000 | Role of intergranular films in toughened ceramics | Becher P.F.; Sun E.Y.; Hsueh C.H.; Painter G.S.; More K.L.; CHUN-HWAY HSUEH | Key Engineering Materials | |||
2008 | Shear fracture of bulk metallic glasses with controlled applied normal stresses | Hsueh C.H.; Bei H.; Liu C.T.; Becher P.F.; George E.P.; CHUN-HWAY HSUEH | Scripta Materialia | |||
2009 | Simple solutions of multilayered discs subjected to biaxial moment loading | Hsueh C.H.; Kelly J.R.; CHUN-HWAY HSUEH | Dental Materials | |||
2013 | Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn | Diyatmika W.; Chu J.P.; Yen Y.W.; Hsueh C.H.; CHUN-HWAY HSUEH | Applied Physics Letters | |||
1998 | Some considerations of asymmetric cracking in an applied-moment double cantilever beam | Hsueh C.H.; Sun Y E.; Becher P.F.; Li J.B.; CHUN-HWAY HSUEH | Journal of Materials Science | |||
1993 | Some considerations of two-way debonding during fibre pull-out | Hsueh C.H.; Becher P.F.; CHUN-HWAY HSUEH | Journal of Materials Science Letters | |||
2005 | Stress distributions in thin bilayer discs subjected to ball-on-ring tests | Hsueh C.H.; Lance M.J.; Ferber M.K.; CHUN-HWAY HSUEH | Journal of the American Ceramic Society | |||
1997 | Stress transfer in a model composite containing a single embedded fiber | Hsueh C.H.; Young R.J.; Yang X.; Becher P.F.; CHUN-HWAY HSUEH | Acta Materialia |