https://scholars.lib.ntu.edu.tw/handle/123456789/424959
標題: | Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging | 作者: | HSUEH C.H. EVANS A.G. CHUN-HWAY HSUEH |
公開日期: | 1985 | 卷: | 68 | 期: | 3 | 起(迄)頁: | 120-127 | 來源出版物: | Journal of the American Ceramic Society | 摘要: | Residual stresses that develop in a metal/ceramic system due to thermal expansion mismatch were calculated for a work?hardening metal. The calculations were conducted for a cylindrical configuration, pertinent to certain microelectronics packaging systems. Experimental measurements of the stress have also been made on a Cu/cordierite ceramic system, using an indentation technique. It is shown that porosity in the metal can plastically expand and provide a mode of dilatational relaxation. Porosity in the metal thus emerges as an important stress?relaxing mechanism. Copyright ? 1985, Wiley Blackwell. All rights reserved |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/424959 | ISSN: | 00027820 | DOI: | 10.1111/j.1151-2916.1985.tb09648.x |
顯示於: | 材料科學與工程學系 |
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