Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2004 | Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints | Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J. | J. Chin. Colloid and Interface Soc. 26: | |||
2016 | Primary endodermal epithelial cell culture from the yolk sac membrane of japanese quail embryos | Lin, H.J.; Wang, S.H.; Pan, Y.H.; Ding, S.-T. | Journal of Visualized Experiments | 5 | 3 | |
2007 | Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG | Scripta Materialia | |||
2007 | Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; ChuangTH | Scripta Materialia | |||
2008 | Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers | Chuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | |||
2014 | Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer | Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG | Journal of Electronic Materials |