Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2006 | In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing | Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R. | Journal of Electronic Materials |