Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2009 | A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology | C.-C. Tsai; Y.-S. Cheng; T.-Y. Huang; RUEY-BEEI WU | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 | |||
2011 | Design of microstrip-to-microstrip via transition in multi-layered LTCC for frequencies up to 67GHz | C.-C. Tsai; Y.-S. Cheng; T.-Y. Huang; A. Y. P. Hsu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging and Manufacturing Technology |