Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2012 | A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Microwave and Wireless Components Letters | 41 | 37 | |
2010 | A stopband enhanced EBG power/ground plane based on via location design | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Compon. Packag. Manuf. Technol. Symp. Japan | 2 | 0 | |
2013 | ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments | C.-D. Wang; Y.-J. Chang; Y.-C. Lu; P.-S. Chen; W.-C. Lo; Y.-P. Chiou; T.-L. Wu; YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 24 | 21 | |
2011 | Accuracy-improved through-silicon-via model using conformal mapping technique | T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Elect. Performance Electron. Package. Systems | 6 | 0 | |
2012 | Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes | C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Microwave Theory and Techniques | 38 | 36 | |
2011 | Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 1 | 0 | |
2010 | Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology | T.-L. Wu; J. Fan; F. d. Paulis; C.-D. Wang; A. C. Scogna; A. Orl; i; Wu, Tzong-Lin | IEICE Transactions on Communications | 20 | 13 | |
2013 | Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression | C.-D. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 28 | 13 | |
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
2010 | Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure | A. C. Scogna; C.-D. Wang; A. Orl; i; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. |