公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2003 | Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler | Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H. | Journal of Materials Engineering and Performance | | | |
2002 | Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals | Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H. | Materials Characterization | | | |
2002 | Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate | Chiang, M. J.; Chuang, T. H. | Zeitschrift fur Metallkunde | | | |
2004 | Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad | Chiang, M. J.; Chang, S. Y.; Chuang, T. H. | Journal of Electronic Materials | | | |