公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2010 | Capacitors with insulating layer having embedded dielectric rods | Kuo-Ching Steven Hsu; Chien-Min Lin; Guan-Tzong Wu; Tzong-Lin Wu; TZONG-LIN WU | ||||
2008 | Design of Reflectionless Vias Using Neural Network-Based Approach | Ku-Teng Hsu; Wei-Da Guo; Guang-Hwa Shiue; Chien-Min Lin; Tian-Wei Huang; Ruey-Beei Wu; TIAN-WEI HUANG ; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 16 | 11 | |
2005 | Model Extractions of Coupled Bonding-wire Structures in Electronic Packaging | Hao-Geng Lin; Tian-Wei Huang; Ruey-Beei Wu; Chien-Min Lin; TIAN-WEI HUANG ; RUEY-BEEI WU | Asia-Pacific Microwave Conference, APMC | 6 | 0 |