公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2004 | The effect of residual thermal stresses on the fatigue crack growth of laser-annealed 304 stainless steels | Tsay, L.W.; Young, M.C.; Chou, F.Y.; Shiue, R.K.; REN-KAE SHIUE | Materials Chemistry and Physics | | | |
2004 | The effect of residual thermal stresses on the fatigue crack growth of laser-annealed 304 stainless steels | Tsay, L.W.; Young, M.C.; Chou, F.Y.; Shiue, R.K. | Materials Chemistry and Physics | | | |
2001 | Effect of solder creep on the reliability of large area die attachment | Zhuang, W.D.; Chang, P.C.; Chou, F.Y.; Shiue, R.K.; REN-KAE SHIUE | Microelectronics Reliability | | | |