Effect of solder creep on the reliability of large area die attachment

Journal

Microelectronics Reliability

Journal Volume

41

Journal Issue

12

Pages

2011-2021

Date Issued

2001

Author(s)

Zhuang, W.D.

Chang, P.C.

Chou, F.Y.

Shiue, R.K.

DOI

10.1016/S0026-2714(01)00101-9

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491913

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035576251&doi=10.1016%2fS0026-2714%2801%2900101-9&partnerID=40&md5=109b009137e737e1181a63c2871cd941

Type

journal article