公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2015 | Annealing-induced indentation recovery in thin film metallic glasses: Effects of indenter tip geometry, film thickness and film composition | Negussie A.T.; Chu J.P.; Diyatmika W.; Lee C.M.; Yu C.-C.; Shen Y.L.; Hsueh C.H.; CHUN-HWAY HSUEH | Surface and Coatings Technology | |||
2014 | Annealing-induced shape recovery in thin film metallic glass | Negussie A.T.; Diyatmika W.; Chu J.P.; Shen Y.L.; Jang J.S.C.; Hsueh C.H.; CHUN-HWAY HSUEH | Journal of Alloys and Compounds | |||
2014 | Effects of annealing on mechanical behavior of Zr-Ti-Ni thin film metallic glasses | Chen C.-S.; Yiu P.; Li C.-L.; Chu J.P.; Shek C.-H.; Hsueh C.-H.; CHUN-HWAY HSUEH | Materials Science and Engineering A | |||
2014 | Fatigue properties improvement of high-strength aluminum alloy by using a ZrCu-based metallic glass thin film coating | Tsai P.H.; Li J.B.; Chang Y.Z.; Lin H.C.; Jang J.S.C.; Chu J.P.; Lee J.W.; Liaw P.K.; HSIN-CHIH LIN | Thin Solid Films | |||
2013 | Rapid relaxation and embrittlement of Zr-based bulk metallic glasses by electropulsing | Yiu P.; Chen Y.C.; Chu J.P.; Chang S.Y.; Bei H.; Jang J.S.C.; Hsueh C.H.; CHUN-HWAY HSUEH | Intermetallics | |||
2013 | Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn | Diyatmika W.; Chu J.P.; Yen Y.W.; Hsueh C.H.; CHUN-HWAY HSUEH | Applied Physics Letters | |||
2014 | Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation | Diyatmika W.; Chu J.P.; Yen Y.W.; Chang W.Z.; Hsueh C.H.; CHUN-HWAY HSUEH | Thin Solid Films | |||
2017 | Viscous flow and viscosity measurement of low-temperature imprintable AuCuSi thin film metallic glasses investigated by nanoindentation creep | Wang C.; Liao Y.-C.; Chu J.P.; Hsueh C.-H.; CHUN-HWAY HSUEH | Materials and Design | |||
2013 | Zr-based metallic glass thin film coating for fatigue-properties improvement of 7075-T6 aluminum alloy | Chang Y.Z.; Tsai P.H.; Li J.B.; Lin H.C.; Jang J.S.C.; Li C.; Chen G.J.; Chen Y.C.; Chu J.P.; Liaw P.K.; HSIN-CHIH LIN | Thin Solid Films | |||
2015 | Zr?VTi?VNi thin film metallic glass as a diffusion barrier between copper and silicon | Wang C.-W.; Yiu P.; Chu J.P.; Shek C.-H.; Hsueh C.-H.; CHUN-HWAY HSUEH | Journal of Materials Science |