公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2008 | A novel stopband-enhanced EBG planes using an embedded slow-wave structure | C.-Y. Hsieh; H.-H. Chuang; T.-K. Wang; C.-C. Wang; H.-H. Cheng; Y.-S. Wu; C.-T. Chiu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 5 | 0 | |
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 18 | 0 | |
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 0 | 0 |