公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1994 | Construction of Recombinant Baculovirus Containing the Bacillus Thuringiensis Delta-Endotoxin Gene | 羅竹芳; Hu, Y. C.; Shih, C. J.; Lo, Chu-Fang | Chinese Journal Entomol | | | |
2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu, Y. C.; Lin, Y. H.; Kao, C. R.; Tu, K. N. | Journal of Materials Research | | | |
2005 | Electromigration induced metal dissolution in flip-chip solder joints | Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Tsai, J. Y.; Kao, C. R.; C. ROBERT KAO | Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5 | | | |
2012 | Synthesis and electrical conductivity of mullite-type Bi <sub>2</sub> Al <sub>4</sub> O <sub>9</sub> and (Bi,Ca) <sub>2</sub> Al <sub>4</sub> O <sub>9</sub> ceramics | Wei, Wen-Cheng James; Chuang, S. Y.; Hu, Y. C.; WEN-CHENG J. WEI | International Journal of Materials Research | 4 | 4 | |