公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2023 | Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study | Gräfner, Simon Johannes; Huang, Jeng Hau; Wu, Po Yi; Renganathan, Vengudusamy; Shih, Po Shao; C. ROBERT KAO | Advanced Materials | | | |
2022 | Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection | YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 2 | 0 | |
2024 | A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications | Huang, Jeng Hau; Shih, Po Shao; Renganathan, Vengudusamy; Gräfner, Simon Johannes; Lin, Yu Chun; Kao, Chin Li; Lin, Yung-Sheng; Hung, Yun Ching; C. ROBERT KAO | Materials | | | |
2023 | Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating using Microfluidic System | Shih, Po Shao; Huang, Jeng Hau; Shen, Chang Hsien; Lin, Yu Chun; Grufner, Simon Johannes; Renganathan, Vengudusamy; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |
2023 | A novel and simple method of low temperature, low process time, pressureless interconnection for 3D packaging | Huang, Jeng Hau; Shih, Po Shao; Shen, Chang Hsien; Renganathan, Vengudusamy; Grafner, Simon Johannes; Lin, Yu Chun; Kao, Chin Li; LIN, Y. S.; Hung, Yun Ching; Chiang, Chun Wei; C. ROBERT KAO | Proceedings - Electronic Components and Technology Conference | 0 | 0 | |