Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2018 | Failure assessments of polymeric structure for electronic connectors | Huang D.-C.; Juo, Yueh-Ting; KUO-CHI LIAO | 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems | 1 | 0 |