公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2001 | Lead-free solder materials and soldering technologies | Kang, S. K.; Mavoori, H.; Chada, S.; Kao, C. R.; Smith, and R. W. | Journal of Electronic Materials | |||
2003 | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO | Journal of Electronic Materials | 1 |