Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

12

Pages

1359-1359

Date Issued

2003

Author(s)

Lucas, J. P.

Chada, S.

Kang, S. K.

Kao, C. R.

Lin, K. L.

Ready, J.

Yu, J.

DOI

10.1007/s11664-003-0100-8

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/490996

Type

journal article