公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2004 | A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits | T.-K. Wang; C.-C. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Application Compat. | |||
2005 | A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards | T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 | |
2007 | A novel EBG power plane with stopband enhancement using artificial substrate | T.-K. Wang; T.-W. Han; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 3 | 0 | |
2005 | A novel embedded power plane with 10GHz stopband for simultaneous switching noise | C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 0 | ||
2008 | A novel HU-shaped common-mode filter for GHz differential signals | S.-J. Wu; H.-H. Chuang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | |||
2005 | A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 155 | 6 | |
2008 | A novel power/ground layer using artificial substrate EBG for simultaneously switching noise suppression | T.-K. Wang; T.-W. Han; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 61 | 45 | |
2008 | A novel stopband-enhanced EBG planes using an embedded slow-wave structure | C.-Y. Hsieh; H.-H. Chuang; T.-K. Wang; C.-C. Wang; H.-H. Cheng; Y.-S. Wu; C.-T. Chiu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 5 | 0 | |
2007 | Broadband noise suppression using a hybrid photonic crystal power/ground plane substrate | Y.-C. Chen; T.-K. Wang; S.-M. Lan; C.-H. Lu; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 0 | 0 | |
2009 | Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression | T.-K. Wang; C.-Y. Hsieh; H.-H. Chuang; T. L. Wu; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 48 | 40 | |
2010 | Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology | W.-Y. Huang; T.-K. Wang; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 1 | 1 | |
2005 | Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 227 | 187 | |
2007 | Modeling noise coupling between package and PCB power/ground planes with an efficient 2-D FDTD/lumped element method | T.-K. Wang; S.-T. Chen; C.-W. Tsai; S.-M. Wu; J. J. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 30 | 22 | |
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 196 | 161 | |
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. | 0 | 0 |