公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | A 340-GHz 2×2 CMOS THz imaging array sensor with high-resistivity silicon superstrate | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | 6th Int. Sensors Science (I3S) | |||
2017 | A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications | Te-Yen Chiu; Chun Wang; Wan-Ting Hsieh; Hsien-Jia Lin; Ta-Yeh Lin; Roger Liu; Da-Chiang Chang; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017 | 6 | 0 | |
2017 | A 340-GHz high-gain silicon dielectric resonator antenna for THz imaging applications | Te-Yen Chiu; Chun-Hsing Li; CHUN-HSING LI | The 28th VLSI/CAD Symposium | |||
2017 | 340-GHz Low-Cost and High-Gain On-Chip Higher Order Mode Dielectric Resonator Antenna for THz Applications | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | IEEE Transactions on Terahertz Science and Technology | 86 | 73 | |
2016 | 340-GHz signal source design with integrated on-chip bondwire antenna in 41-nm CMOS | Te-Yen Chiu; Chun-Lin Ko; Chun-Hsing Li; Ming-Ching Kuo; and Da-Chiang Chang; CHUN-HSING LI | Proceedings of 2016 6th International Workshop on Computer Science and Engineering | 0 | 0 | |
2017 | Enhancement of CMOS THz imaging sensing by packaging technology | Chien-Nan Kuo; Wei-Cheng Chen; Te-Yen Chiu; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) | 0 | 0 | |
2020 | A low-loss balun-embedded interconnect for THz heterogeneous system integration | Te-Yen Chiu; Yu-Ling Lee; Chun-Lin Ko; Sheng-Hsiang Tseng; CHUN-HSING LI | International Microwave Symposium | 1 | 0 | |
2018 | A silicon-based parabolic sub-THz reflector antenna for gain enhancement and near-field focus applications | Meng-Tse Hsu; Te-Yen Chiu; Syuan-Yu Wu; Yu-Ting Cheng; Chun-Hsing Li; and Chien-Nan Kuo; CHUN-HSING LI | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) | 3 | 0 | |
2019 | Single flip-chip packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | IEEE Access | 16 | 15 |