公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2002 | Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates | Chiu, M.Y.; Chang, S.Y.; Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG | Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques | | | |
1993 | Designing High-Order Neural Networks Using Genetic Algorithms with Application to Decoding Error-Correcting Codes | Tseng, Y.H.; J.Shiu; Wu, Ja-Ling | Inte'l Symp. on Communications | | | |
1999 | Interfacial Reactions between Liquid Indium and Nickel Substrate | Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2006 | Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates | Wang, S.S.; Tseng, Y.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | 14 | 14 | |
1992 | SOLVING SORTING AND RELATED
PROBLEMS BY QUADRATIC PERCEPTRONS | Tseng, Y.H.; JA-LING WU | ELECTRONICS LETTERS 7th May | 8 | 8 | |
2015 | Taxonomic revision of Elatostema J. R. Forst. & G. Forst. (Urticaceae) in Taiwan | Tseng, Y.H.; JER-MING HU | Taiwania | 3 | 3 | |