Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates

Journal

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Journal Volume

93

Journal Issue

3

Pages

248-252

Date Issued

2002

Author(s)

Chiu, M.Y.

Chang, S.Y.

Tseng, Y.H.

Chan, Y.C.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.3139/146.020248

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492037

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036500638&doi=10.3139%2f146.020248&partnerID=40&md5=fce1923715bca6bbf58b26cbf5f3f556

Type

journal article