公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2003 | Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages | Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG | Journal of Electronic Materials | |||
2008 | Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish | Chuang, T.H.; Jain, C.C.; Wu, H.M.; ChuangTH | Journal of Electronic Materials |