公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2008 | Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration | Lin, Chiung-Wen; Hsu, Chia-Pao; Yang, Hsueh-An; Wang, Wei Chung; WEICHUNG WANG | Journal of Micromechanics and Microengineering | 53 | 45 | |
2007 | Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections | Lin, Chiung-Wen; Yang, Hsueh-An; Wang, Wei Chung; WEICHUNG WANG | Journal of Micromechanics and Microengineering | 48 | 45 |