Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Journal

Journal of Micromechanics and Microengineering

Journal Volume

18

Journal Issue

2

Pages

25018

Date Issued

2008

Author(s)

Lin, Chiung-Wen

Hsu, Chia-Pao

Yang, Hsueh-An

Wang, Wei Chung

DOI

URI

Type

journal article