公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2017 | A 340-GHz high-gain flip-chip packaged dielectric resonator antenna for THz imaging applications | Te-Yen Chiu; Chun Wang; Wan-Ting Hsieh; Hsien-Jia Lin; Ta-Yeh Lin; Roger Liu; Da-Chiang Chang; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2017 | 6 | 0 | |
2019 | A?X?/Ku-Band QFN-Packaged GaAs LNA Supporting Dual-Polarization Signal Reception | Chun Wang; Kuang-Yu Chen; Yu-Ling Lee; and Chun-Hsing Li; CHUN-HSING LI | 2019 IEEE Asia-Pacific Microwave Conference (APMC) | 3 | 0 | |
2018 | Compact low-cost five-band RF energy harvester using system-in-package integration | Yen-Wei Chang; Ming-Che Yu; Hsien-Jia Lin; and Chun-Hsing Li; CHUN-HSING LI | IEEE Radio and Wireless Symposium, RWS | 1 | 0 | |
2017 | Enhancement of CMOS THz imaging sensing by packaging technology | Chien-Nan Kuo; Wei-Cheng Chen; Te-Yen Chiu; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) | 0 | 0 |