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	Issue Date	Title	Author(s)	Source	scopus	WOS	Fulltext/Archive link
1	2013	Testing Leakage Faults of Power TSV in 3D IC	CHIEN-MO LI ; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI	IEEE Int’l workshop on 3D IC