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.National Taiwan University / 國立臺灣大學
Project / 研究計畫
開發應用於高功率半導體封裝之新穎銀合金膠材料(3/4)
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開發應用於高功率半導體封裝之新穎銀合金膠材料(3/4)
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Primary Data
Project title
開發應用於高功率半導體封裝之新穎銀合金膠材料(3/4)
Internal ID
112-2223-E-002-016-(博士生增核)
Principal Investigator
C. ROBERT KAO
Start Date
September 1, 2023
End Date
July 31, 2024
Organizations
Materials Science and Engineering
Partner Organizations
National Science and Technology Council
