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.National Taiwan University / 國立臺灣大學
Project / 研究計畫
矽晶及碳化矽晶濺鍍與蒸鍍銅奈米孿晶薄膜及其在功率IC封裝之低溫固晶接合應用
矽晶及碳化矽晶濺鍍與蒸鍍銅奈米孿晶薄膜及其在功率IC封裝之低溫固晶接合應用
Details
Primary Data
Project title
矽晶及碳化矽晶濺鍍與蒸鍍銅奈米孿晶薄膜及其在功率IC封裝之低溫固晶接合應用
Internal ID
111-2221-E-002-156-
Principal Investigator
TUNG-HAN CHUANG
Start Date
August 1, 2022
End Date
July 31, 2023
Organizations
Materials Science and Engineering
Partner Organizations
National Science and Technology Council