Project title
以燒結銀銦為接合技術之高溫高功率之電力晶片封裝技術開發
Internal ID
107L4000(高振宏)
Principal Investigator
Start Date
December 1, 2018
End Date
November 30, 2019
Organizations
Partner Organizations
Higher Education Sprout Project
以燒結銀銦為接合技術之高溫高功率之電力晶片封裝技術開發
Keywords
耐高溫封裝材料
高功率模組晶片接合技術
奈米銀膠燒結
銀銦暫液態接合
銦 添加
抗氧化性質
抗硫化性質
High temperature packaging material
high power module die attachment technology
nano-silver paste sintering
silver-indium transient liquid phase bonding
indium addition
anti-oxidation property
anti-tarnishing property