Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
Journal
Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques
Journal Volume
93
Journal Issue
12
Pages
1194-1198
Date Issued
2002
Author(s)
Abstract
Abstract The morphology and growth kinetics of the intermetallic compound formed during the reaction between liquid Sn-20In-2.8Ag solder and Ag substrate are studied in the temperature range 225�V325 �XC. The results indicate that the intermetallic compound Ag2+x(In, Sn) of scallop shape appears at the interface. The intermetallic thickness versus reaction time shows a parabolic relation, indicating that the growth of this intermetallic is diffusion-controlled. The activation energy calculated from the Arrhenius plot of the intermetallic growth rate is 41.6 kJ/mol. By marking the original interface with a Ta thin film, the dissolution of Ag into solder and the growth mechanism of the intermetallic compound have been clarified.
SDGs
Type
journal article