Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate

Journal

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Journal Volume

93

Journal Issue

12

Pages

1194-1198

Date Issued

2002

Author(s)

Chiang, M.J.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.3139/146.021194

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492032

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036944619&doi=10.3139%2f146.021194&partnerID=40&md5=abb6387923f8ef5daa5047192634fa09

SDGs

[SDGs]SDG7

Type

journal article