Pre-oxidation of AlN substrates for subsequent metallization
Journal
Journal of Materials Science: Materials in Electronics
Journal Volume
26
Journal Issue
8
Pages
5910-5916
Date Issued
2015
Author(s)
Abstract
To introduce a surface oxide layer onto aluminum nitride substrate helps its subsequent metallization. In the present study, the oxidation behavior of AlN substrate is investigated. The pre-oxidized AlN substrate is then bonded to a copper plate. The oxide layer of the substrate is porous, and its presence degrades thermal diffusivity and flexural strength at thicknesses greater than 6 μm. An AlN substrate with a thin oxide layer can bond directly to copper plate at 1070 °C. The thin oxide layer remains stable after bonding with copper plate; however, it acts as a barrier to thermal conduction.
Type
journal article