Electromigration-induced failure in flip-chip solder joints

Journal

Journal of Electronic Materials

Journal Volume

34

Journal Issue

1

Pages

27-33

Date Issued

2005

Author(s)

Lin Y.H.

Tsai C.M.

Hu Y.C.

Lin Y.L.

DOI

10.1007/s11664-005-0176-4

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-13244294160&doi=10.1007%2fs11664-005-0176-4&partnerID=40&md5=e7204e8112cd38138208239bdc6d64db

https://scholars.lib.ntu.edu.tw/handle/123456789/432718

Publisher

Minerals, Metals and Materials Society

Type

journal article