Performance comparison of flip-chip-assembled 5-GHz 0.18-μm CMOS power amplifiers on different packaging substrates

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal Volume

3

Journal Issue

12

Pages

2014-2021

Date Issued

2013

Author(s)

Kuo, C.-C.

Hsu, Y.-W.

Huang, W.-C.

Wang, H.

DOI

10.1109/TCPMT.2013.2282295

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/497568

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84890997367&doi=10.1109%2fTCPMT.2013.2282295&partnerID=40&md5=a87f1f1f099f31c54ab96d26d1748b18

Type

journal article